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Products > Bonding Equipments  

     Bonding Equipments

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Bonding Equipments

FOG Bonder

The equipment is to bond FPC onto glass panel in TFT/LCD manufacturing by Auto aligning with keeping determined time, temperature and pressure condition.

* Specification
   
a. High Reliability and accuracy.
   b. Auto Alignment/Self-Developed Image
        Processing System. 
   c. Quick adjustment for different size of panel.
   d. CIM interface available.

COG Bonder

The equipment is to bond Chip onto glass panel in TFT/LCD manufacturing by Auto aligning with keeping determined time, temperature and pressure condition.

* Specification
   
a. High Reliability and accuracy.
   b. Auto Alignment/Self-Developed Image
        Processing System. 
   c. Quick adjustment for different size of panel.
   d. CIM interface available.

TAB Bonder

The equipment is to bond TAB onto glass panel in TFT/LCD manufacturing by Auto aligning with keeping determined time, temperature and pressure condition.

* Specification
   
a. High Reliability and accuracy.
   b. Auto Alignment/Self-Developed Image
        Processing System. 
   c. Quick adjustment for different size of panel.
   d. CIM interface available.

PCB Bonder

The equipment is to bond PCB onto glass panel in TFT/LCD manufacturing by Auto aligning with keeping determined time, temperature and pressure condition.

* Specification
  
 a. High Reliability and accuracy.
   b. Auto Alignment/Self-Developed Image
        Processing System. 
   c. Quick adjustment for different size of panel.
   d. CIM interface available.

    Specifications may be changed without notice.
    Specifications are subject to customer's technical requirement.
    Customer oriented design available.
    Please contact our sales staff for details of products and services.
    The pictures of products in this website may not be the same as the delivered products.

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